HSIB916-1

HSIB916-1

Images are for reference only
See Product Specifications

HSIB916-1
Description:
AC, HEAT SPREADER FOR IB916/ IB9
Package:
Box
Datasheet:
HSIB916-1 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:HSIB916-1
Category:Fans, Thermal Management
Subcategory:Thermal - Heat Sinks
Manufacturer:iBASE Technology
Packaging:Box
Product Status:Active
Type:Heat Spreader
Package Cooled:IB916, IB917
Attachment Method:-
Shape:-
Length:-
Width:-
Diameter:-
Fin Height:-
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:-
Thermal Resistance @ Natural:-
Material:-
Material Finish:-
In Stock: 1
Stock:
1 Can Ship Immediately
  • Share:
For Use With
ATS-03E-138-C3-R0
ATS-03E-138-C3-R0
Advanced Thermal Solutions Inc.
HEATSINK 25X25X15MM L-TAB T412
ATS-11G-203-C1-R0
ATS-11G-203-C1-R0
Advanced Thermal Solutions Inc.
HEATSINK 54X54X10MM XCUT
ATS-02D-155-C1-R0
ATS-02D-155-C1-R0
Advanced Thermal Solutions Inc.
HEATSINK 40X40X20MM L-TAB
ATS-01H-91-C3-R0
ATS-01H-91-C3-R0
Advanced Thermal Solutions Inc.
HEATSINK 40X40X10MM R-TAB T412
ATS-19C-77-C3-R0
ATS-19C-77-C3-R0
Advanced Thermal Solutions Inc.
HEATSINK 25X25X30MM R-TAB T412
ATS-14F-177-C3-R0
ATS-14F-177-C3-R0
Advanced Thermal Solutions Inc.
HEATSINK 35X35X20MM R-TAB T412
ATS-13C-31-C1-R0
ATS-13C-31-C1-R0
Advanced Thermal Solutions Inc.
HEATSINK 57.9X36.83X5.84MM
ATS-08F-32-C1-R0
ATS-08F-32-C1-R0
Advanced Thermal Solutions Inc.
HEATSINK 57.9X36.83X11.43MM
ATS-05E-64-C2-R0
ATS-05E-64-C2-R0
Advanced Thermal Solutions Inc.
HEATSINK 40X40X25MM L-TAB T766
ATS-15E-94-C2-R0
ATS-15E-94-C2-R0
Advanced Thermal Solutions Inc.
HEATSINK 40X40X25MM R-TAB T766
ATS-10G-35-C3-R0
ATS-10G-35-C3-R0
Advanced Thermal Solutions Inc.
HEATSINK 36.83X57.6X5.84MM T412
ATS-02H-41-C3-R0
ATS-02H-41-C3-R0
Advanced Thermal Solutions Inc.
HEATSINK 57.9X60.96X17.78MM T412
You May Also Be Interested In
AUDIO-18
AUDIO-18
iBASE Technology
AUDIO CABLE FOR 3.5" SBC AUDIO B
IP406
IP406
iBASE Technology
FC, PCIE(1X) TO MINIPCIE + SIM C
FWA8408/6 KIT10
FWA8408/6 KIT10
iBASE Technology
MODEL FWA8408, FWA8406, A: 1 X E
IB818F-335 (B-1 STEPPING)
IB818F-335 (B-1 STEPPING)
iBASE Technology
3.5" INTEL CELERON N3350 DC SOC
MI808F-300
MI808F-300
iBASE Technology
ITX, INTEL CELERON N3000 (1.04GH
IB903FC-12
IB903FC-12
iBASE Technology
3.5", AMD EMBEDDED G-SERIES DC S
MB970F
MB970F
iBASE Technology
ATX, LGA1155 CORE I7/I5/I3, B75
ET975K-I5VE32
ET975K-I5VE32
iBASE Technology
COM EXPRESS (TYPE 6), INTEL CORE
MI988F-1807
MI988F-1807
iBASE Technology
ITX, AMD RYZEN V1807B QC APU (3.
IB897-I45/I45P
IB897-I45/I45P
iBASE Technology
3.5" INTEL ATOM E3845 QC SOC (1.
IB897-I27/I27P
IB897-I27/I27P
iBASE Technology
3.5" INTEL ATOM E3827 DC SOC (1.
H052LGA1155001000P
H052LGA1155001000P
iBASE Technology
AC, COOLER HEATSINK FOR INTEL SO