HSIB906-BGA

HSIB906-BGA

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See Product Specifications

HSIB906-BGA
Description:
AC, HEATSINK FOR IB906F-1G, (ROH
Package:
Box
Datasheet:
HSIB906-BGA Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:HSIB906-BGA
Category:Fans, Thermal Management
Subcategory:Thermal - Heat Sinks
Manufacturer:iBASE Technology
Packaging:Box
Product Status:Active
Type:Top Mount
Package Cooled:IB906-1G
Attachment Method:-
Shape:-
Length:-
Width:-
Diameter:-
Fin Height:-
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:-
Thermal Resistance @ Natural:-
Material:-
Material Finish:-
In Stock: 1
Stock:
1 Can Ship Immediately
  • Share:
For Use With
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CUI Devices
HEAT SINK, EXTRUSION, TO-218, 38
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