HSIB811-I

HSIB811-I

Images are for reference only
See Product Specifications

HSIB811-I
Description:
AC, HEATSINK FOR IB811-I30/I40/I
Package:
Box
Datasheet:
HSIB811-I Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:HSIB811-I
Category:Fans, Thermal Management
Subcategory:Thermal - Heat Sinks
Manufacturer:iBASE Technology
Packaging:Box
Product Status:Active
Type:Top Mount
Package Cooled:IB811F-I50/I40/I30
Attachment Method:-
Shape:-
Length:-
Width:-
Diameter:-
Fin Height:-
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:-
Thermal Resistance @ Natural:-
Material:-
Material Finish:-
In Stock: 1
Stock:
1 Can Ship Immediately
  • Share:
For Use With
ATS-03H-139-C1-R0
ATS-03H-139-C1-R0
Advanced Thermal Solutions Inc.
HEATSINK 25X25X20MM L-TAB
ATS-21F-114-C1-R0
ATS-21F-114-C1-R0
Advanced Thermal Solutions Inc.
HEATSINK 40X40X15MM XCUT
ATS-17B-194-C3-R0
ATS-17B-194-C3-R0
Advanced Thermal Solutions Inc.
HEATSINK 40X40X10MM XCUT T412
ATS-15D-196-C3-R0
ATS-15D-196-C3-R0
Advanced Thermal Solutions Inc.
HEATSINK 45X45X6MM XCUT T412
ATS-21H-92-C1-R0
ATS-21H-92-C1-R0
Advanced Thermal Solutions Inc.
HEATSINK 40X40X15MM R-TAB
ATS-18G-144-C3-R0
ATS-18G-144-C3-R0
Advanced Thermal Solutions Inc.
HEATSINK 30X30X25MM L-TAB T412
ATS-13A-90-C1-R0
ATS-13A-90-C1-R0
Advanced Thermal Solutions Inc.
HEATSINK 35X35X35MM R-TAB
ATS-18F-113-C2-R0
ATS-18F-113-C2-R0
Advanced Thermal Solutions Inc.
HEATSINK 40X40X10MM XCUT T766
ATS-18D-109-C1-R1
ATS-18D-109-C1-R1
Advanced Thermal Solutions Inc.
HEATSINK 54.00MM X 54.00MM ALUM
ATS-19B-129-C3-R0
ATS-19B-129-C3-R0
Advanced Thermal Solutions Inc.
HEATSINK 60X60X10MM XCUT T412
ATS-H1-62-C2-R0
ATS-H1-62-C2-R0
Advanced Thermal Solutions Inc.
HEATSINK 40X40X15MM L-TAB T766
533602B02500G
533602B02500G
Aavid, Thermal Division of Boyd Corporation
BOARD LEVEL HEAT SINK
You May Also Be Interested In
UPC-7210 -I73
UPC-7210 -I73
iBASE Technology
21.5 FANLESS PANEL PC, INTEL COR
IB90
IB90
iBASE Technology
KIT, W/USB 3.0, COM, POWER CABLE
FWA8506 KIT3
FWA8506 KIT3
iBASE Technology
MODEL FWA8506, A: NONE; B: 2 X 2
IBN-S400 WITH TRAY
IBN-S400 WITH TRAY
iBASE Technology
NIC WITH TRAY, INTEL I350-AM4, 4
IBP167
IBP167
iBASE Technology
FC, INTEL I350-AM4 GBE, 8-PORT E
IBN-S420QSX WITH TRAY
IBN-S420QSX WITH TRAY
iBASE Technology
NIC WITH TRAY, INTEL I350-AM4, 4
ASB200-903D
ASB200-903D
iBASE Technology
(ASB), CHASSIS WITH IB903F-16 BO
ASB200-903Q
ASB200-903Q
iBASE Technology
(ASB), CHASSIS WITH IB903F-Q15 B
ASB200-916-I3
ASB200-916-I3
iBASE Technology
(ASB), CHASSIS WITH IB916F-7100
MI808F-300
MI808F-300
iBASE Technology
ITX, INTEL CELERON N3000 (1.04GH
MI987AF
MI987AF
iBASE Technology
ITX, LGA1150 CORE I7/I5/I3, Q87
ET976-1202LV-E4G
ET976-1202LV-E4G
iBASE Technology
COM EXPRESS (TYPE 6), AMD RYZEN