F6SXX-HSK HEATSINK

F6SXX-HSK HEATSINK

Images are for reference only
See Product Specifications

F6SXX-HSK HEATSINK
Description:
F6XX HEAT SPREADER
Package:
Box
Datasheet:
F6SXX-HSK HEATSINK Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:F6SXX-HSK HEATSINK
Category:Embedded Computers
Subcategory:Accessories
Manufacturer:iBASE Technology
Packaging:Box
Product Status:Active
Accessory Type:Heat Sink
Specifications:-
In Stock: 1
Stock:
1 Can Ship Immediately
  • Share:
For Use With
VL-CBR-1202
VL-CBR-1202
VersaLogic Corporation
1' 12PIN 0.5MM FFC/15PIN VGA
IBN-S800 WITH TRAY
IBN-S800 WITH TRAY
iBASE Technology
NIC WITH TRAY, INTEL I350-AM4 X2
1750007991-01
1750007991-01
Advantech Corp
ANTENNA GPS+BDS+GONASS 5000MM
1960047669N001
1960047669N001
Advantech Corp
CPU COOLER LGA1156 4U/WM CHASSIS
PCA-COM485-00A1E
PCA-COM485-00A1E
Advantech Corp
4 PORTS RS-485/422 MOD BY LPC A
VL-MM10-16EBN
VL-MM10-16EBN
VersaLogic Corporation
DRAM 16 GB PC4-2133 SODIMM DDR4,
HPC-7120-00XE
HPC-7120-00XE
Advantech Corp
1U SHORT DEPTH SERVER CHASSIS
VL-HDD35-320
VL-HDD35-320
VersaLogic Corporation
3.5 HD, 320 GB, ATA100, 7200RPM
VL-WD10-CBN
VL-WD10-CBN
VersaLogic Corporation
EXP MINIPCIE 802.11A/B/G/N WIFI
989K610302E
989K610302E
Advantech Corp
1U 3 SLOT BP W/ 2 PCI 1CPU
IPC-619BP-00XE
IPC-619BP-00XE
Advantech Corp
4U 15-SLOT CHASSIS B VERSION CHA
MM8-CSBN
MM8-CSBN
VersaLogic Corporation
IC DRAM DDR MEMORY
You May Also Be Interested In
FWA8408/6 KIT6
FWA8408/6 KIT6
iBASE Technology
MODEL FWA8408, FWA8406, A: 1 X 3
ID883
ID883
iBASE Technology
FC, 9V~30V WIDE RANGE POWER INTE
IBN-S400
IBN-S400
iBASE Technology
NIC, INTEL I350-AM4, 4-PORT GBE
IDT-7104 POE CARD
IDT-7104 POE CARD
iBASE Technology
IDT-7104 POE CARD
IBN-R840 WITH TRAY
IBN-R840 WITH TRAY
iBASE Technology
NIC WITH TRAY, INTEL I350-AM4 X2
ET870-I30-LV
ET870-I30-LV
iBASE Technology
COM EXPRESS (TYPE 6), INTEL ATOM
MI808F-370
MI808F-370
iBASE Technology
ITX, INTEL PENTIUM N3700 (1.6GHZ
MI981AF
MI981AF
iBASE Technology
ITX, LGA1150 CORE I7/I5/I3, Q87
MI956F
MI956F
iBASE Technology
ITX, INTEL 2ND GEN. MOBILE CORE
MI979MF-421D
MI979MF-421D
iBASE Technology
ITX, AMD RX421BD APU (2.1GHZ/3.4
HSIB818-I
HSIB818-I
iBASE Technology
AC, HEATSINK FOR IB818-I50/I40/I
FWA8308-164
FWA8308-164
iBASE Technology
FWA 1U 19" RACKMOUNT APPLIANCE,