D0824-01

D0824-01

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D0824-01
Mfr.:
Description:
CONN IC DIP SOCKET 24POS GOLD
Package:
Bulk
Datasheet:
D0824-01 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:D0824-01
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Harwin Inc.
Packaging:Bulk
Product Status:Obsolete
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):24 (2 x 12)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Wire Wrap
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:196.9µin (5.00µm)
Contact Material - Post:Brass
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
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For Use With
110-87-636-41-005101
110-87-636-41-005101
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SKT PGA SOLDRTL
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CONN IC DIP SOCKET 40POS TIN
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