D0818-01

D0818-01

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D0818-01
Mfr.:
Description:
CONN IC DIP SOCKET 18POS GOLD
Package:
Bulk
Datasheet:
D0818-01 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:D0818-01
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Harwin Inc.
Packaging:Bulk
Product Status:Obsolete
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):18 (2 x 9)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Wire Wrap
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:196.9µin (5.00µm)
Contact Material - Post:Brass
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Operating Temperature:-55°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
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For Use With
110-87-318-41-105191
110-87-318-41-105191
Preci-Dip
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06-6513-10T
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114-83-628-41-134191
114-83-628-41-134191
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110-83-632-41-005101
110-83-632-41-005101
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111-91-636-41-001000
Mill-Max Manufacturing Corp.
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116-93-318-41-008000
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CONN IC DIP SOCKET 18POS GOLD
36-6621-30
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Aries Electronics
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Amphenol ICC (FCI)
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511-13-209-17-081001
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SKT PGA SOLDRTL
522-13-133-14-071003
522-13-133-14-071003
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
523-13-144-15-082002
523-13-144-15-082002
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
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