HSB26-343408

HSB26-343408

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See Product Specifications

HSB26-343408
Mfr.:
Description:
HEAT SINK, BGA, 33.5 X 33.5 X 8
Package:
Box
Datasheet:
HSB26-343408 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:HSB26-343408
Category:Fans, Thermal Management
Subcategory:Thermal - Heat Sinks
Manufacturer:CUI Devices
Packaging:Box
Product Status:Active
Type:Top Mount
Package Cooled:BGA
Attachment Method:Adhesive
Shape:Square, Pin Fins
Length:1.319" (33.50mm)
Width:1.319" (33.50mm)
Diameter:-
Fin Height:0.315" (8.00mm)
Power Dissipation @ Temperature Rise:4.94W @ 75°C
Thermal Resistance @ Forced Air Flow:5.30°C/W @ 200 LFM
Thermal Resistance @ Natural:15.19°C/W
Material:Aluminum Alloy
Material Finish:Black Anodized
In Stock: 1219
Stock:
1219 Can Ship Immediately
  • Share:
For Use With
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