BDN15-3CB/A01

BDN15-3CB/A01

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BDN15-3CB/A01
Description:
HEATSINK CPU W/ADHESIVE 1.51"SQ
Package:
Tray
Datasheet:
BDN15-3CB/A01 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:BDN15-3CB/A01
Category:Fans, Thermal Management
Subcategory:Thermal - Heat Sinks
Manufacturer:CTS Thermal Management Products
Packaging:Tray
Product Status:Active
Type:Top Mount
Package Cooled:Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:Thermal Tape, Adhesive (Included)
Shape:Square, Pin Fins
Length:1.510" (38.35mm)
Width:1.510" (38.35mm)
Diameter:-
Fin Height:0.355" (9.02mm)
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:4.50°C/W @ 400 LFM
Thermal Resistance @ Natural:15.10°C/W
Material:Aluminum
Material Finish:Black Anodized
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
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