BDN15-3CB/A01

BDN15-3CB/A01

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BDN15-3CB/A01
Description:
HEATSINK CPU W/ADHESIVE 1.51"SQ
Package:
Tray
Datasheet:
BDN15-3CB/A01 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:BDN15-3CB/A01
Category:Fans, Thermal Management
Subcategory:Thermal - Heat Sinks
Manufacturer:CTS Thermal Management Products
Packaging:Tray
Product Status:Active
Type:Top Mount
Package Cooled:Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:Thermal Tape, Adhesive (Included)
Shape:Square, Pin Fins
Length:1.510" (38.35mm)
Width:1.510" (38.35mm)
Diameter:-
Fin Height:0.355" (9.02mm)
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:4.50°C/W @ 400 LFM
Thermal Resistance @ Natural:15.10°C/W
Material:Aluminum
Material Finish:Black Anodized
In Stock: 0
Stock:
0 Can Ship Immediately
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For Use With
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ATS-20A-55-C1-R0
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Advanced Thermal Solutions Inc.
HEATSINK 35X35X10MM L-TAB
ATS-20F-138-C3-R0
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Advanced Thermal Solutions Inc.
HEATSINK 25X25X15MM L-TAB T412
ATS-09F-155-C1-R0
ATS-09F-155-C1-R0
Advanced Thermal Solutions Inc.
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ATS-10G-201-C3-R0
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HEATSINK 50X50X12MM XCUT T412
ATS-09F-69-C3-R0
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ATS-17E-05-C2-R0
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Advanced Thermal Solutions Inc.
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ATS-14B-54-C2-R0
ATS-14B-54-C2-R0
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ATS-09E-37-C1-R0
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Advanced Thermal Solutions Inc.
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ATS-P2-38-C1-R0
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