BDN11-3CB/A01

BDN11-3CB/A01

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BDN11-3CB/A01
Description:
HEATSINK CPU W/ADHESIVE 1.11"SQ
Package:
Box
Datasheet:
BDN11-3CB/A01 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:BDN11-3CB/A01
Category:Fans, Thermal Management
Subcategory:Thermal - Heat Sinks
Manufacturer:CTS Thermal Management Products
Packaging:Box
Product Status:Active
Type:Top Mount
Package Cooled:Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:Thermal Tape, Adhesive (Included)
Shape:Square, Pin Fins
Length:1.110" (28.19mm)
Width:1.110" (28.19mm)
Diameter:-
Fin Height:0.355" (9.02mm)
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:7.20°C/W @ 400 LFM
Thermal Resistance @ Natural:20.90°C/W
Material:Aluminum
Material Finish:Black Anodized
In Stock: 3310
Stock:
3310 Can Ship Immediately
  • Share:
For Use With
ATS-17A-177-C1-R0
ATS-17A-177-C1-R0
Advanced Thermal Solutions Inc.
HEATSINK 35X35X20MM R-TAB
ATS-20B-143-C3-R0
ATS-20B-143-C3-R0
Advanced Thermal Solutions Inc.
HEATSINK 30X30X20MM L-TAB T412
ATS-08D-83-C1-R0
ATS-08D-83-C1-R0
Advanced Thermal Solutions Inc.
HEATSINK 30X30X30MM R-TAB
ATS-03F-15-C1-R0
ATS-03F-15-C1-R0
Advanced Thermal Solutions Inc.
HEATSINK 50X50X25MM XCUT
ATS-16C-145-C3-R0
ATS-16C-145-C3-R0
Advanced Thermal Solutions Inc.
HEATSINK 30X30X30MM L-TAB T412
ATS-09E-65-C1-R0
ATS-09E-65-C1-R0
Advanced Thermal Solutions Inc.
HEATSINK 40X40X30MM L-TAB
ATS-20F-65-C3-R0
ATS-20F-65-C3-R0
Advanced Thermal Solutions Inc.
HEATSINK 40X40X30MM L-TAB T412
ATS-10G-191-C3-R0
ATS-10G-191-C3-R0
Advanced Thermal Solutions Inc.
HEATSINK 45X45X30MM R-TAB T412
ATS-13D-77-C2-R0
ATS-13D-77-C2-R0
Advanced Thermal Solutions Inc.
HEATSINK 25X25X30MM R-TAB T766
ATS-06H-64-C2-R0
ATS-06H-64-C2-R0
Advanced Thermal Solutions Inc.
HEATSINK 40X40X25MM L-TAB T766
ATS-01C-30-C1-R0
ATS-01C-30-C1-R0
Advanced Thermal Solutions Inc.
HEATSINK 70X70X25MM XCUT
7-438-X44-BA
7-438-X44-BA
CTS Thermal Management Products
HEATSINK
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