APF19-19-13CB

APF19-19-13CB

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APF19-19-13CB
Description:
HEATSINK LOW-PROFILE FORGED
Package:
Box
Datasheet:
APF19-19-13CB Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:APF19-19-13CB
Category:Fans, Thermal Management
Subcategory:Thermal - Heat Sinks
Manufacturer:CTS Thermal Management Products
Packaging:Box
Product Status:Active
Type:Top Mount
Package Cooled:Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:Thermal Tape, Adhesive (Not Included)
Shape:Square, Fins
Length:0.748" (19.00mm)
Width:0.748" (19.00mm)
Diameter:-
Fin Height:0.500" (12.70mm)
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:4.00°C/W @ 200 LFM
Thermal Resistance @ Natural:-
Material:Aluminum
Material Finish:Black Anodized
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
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