Images are for reference only
See Product Specifications
| Part Number: | TS391SNL250 |
| Category: | Soldering, Desoldering, Rework Products |
| Subcategory: | Solder |
| Manufacturer: | Chip Quik Inc. |
| Packaging: | Bulk |
| Product Status: | Active |
| Type: | Solder Paste |
| Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter: | - |
| Melting Point: | 423 ~ 428°F (217 ~ 220°C) |
| Flux Type: | No-Clean |
| Wire Gauge: | - |
| Mesh Type: | 4 |
| Process: | Lead Free |
| Form: | Jar, 8.8 oz (250g) |
| Shelf Life: | 12 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | 68°F ~ 77°F (20°C ~ 25°C) |
