TC3-3.5G

TC3-3.5G

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See Product Specifications

TC3-3.5G
Description:
HEAT SINK THERMAL COMPOUND
Package:
Bulk
Datasheet:
TC3-3.5G Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:TC3-3.5G
Category:Fans, Thermal Management
Subcategory:Thermal - Adhesives, Epoxies, Greases, Pastes
Manufacturer:Chip Quik Inc.
Packaging:Bulk
Product Status:Active
Type:Silicone Compound
Size / Dimension:3.5 gram Syringe
Usable Temperature Range:-40°F ~ 302°F (-40°C ~ 150°C)
Color:Gray
Thermal Conductivity:8.50W/m-K
Features:-
Shelf Life:60 Months
Storage/Refrigeration Temperature:37°F ~ 77°F (3°C ~ 25°C)
In Stock: 23
Stock:
23 Can Ship Immediately
  • Share:
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