TC1-200G

TC1-200G

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See Product Specifications

TC1-200G
Description:
HEAT SINK COMPOUND - HIGH DENSIT
Package:
Bulk
Datasheet:
TC1-200G Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:TC1-200G
Category:Fans, Thermal Management
Subcategory:Thermal - Adhesives, Epoxies, Greases, Pastes
Manufacturer:Chip Quik Inc.
Packaging:Bulk
Product Status:Active
Type:Silicone Compound
Size / Dimension:200 gram Jar
Usable Temperature Range:-
Color:White
Thermal Conductivity:0.67W/m-K
Features:-
Shelf Life:60 Months
Storage/Refrigeration Temperature:37°F ~ 77°F (3°C ~ 25°C)
In Stock: 6
Stock:
6 Can Ship Immediately
  • Share:
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