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See Product Specifications
| Part Number: | SMD291SNL60T4 |
| Category: | Soldering, Desoldering, Rework Products |
| Subcategory: | Solder |
| Manufacturer: | Chip Quik Inc. |
| Packaging: | Jar |
| Product Status: | Active |
| Type: | Solder Paste, Two Part Mix |
| Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter: | - |
| Melting Point: | 423 ~ 428°F (217 ~ 220°C) |
| Flux Type: | No-Clean |
| Wire Gauge: | - |
| Mesh Type: | 4 |
| Process: | Lead Free |
| Form: | Jar, 2.12 oz (60g) |
| Shelf Life: | 24 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | 37°F ~ 77°F (3°C ~ 25°C) |
