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| Part Number: | SMD291SNL500T5 |
| Category: | Soldering, Desoldering, Rework Products |
| Subcategory: | Solder |
| Manufacturer: | Chip Quik Inc. |
| Packaging: | Jar |
| Product Status: | Active |
| Type: | Solder Paste |
| Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter: | - |
| Melting Point: | 423 ~ 428°F (217 ~ 220°C) |
| Flux Type: | No-Clean |
| Wire Gauge: | - |
| Mesh Type: | 5 |
| Process: | Lead Free |
| Form: | Jar, 17.64 oz (500g) |
| Shelf Life: | 6 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | 37°F ~ 46°F (3°C ~ 8°C) |
