PA0192

PA0192

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See Product Specifications

PA0192
Description:
TSSOP-14-EXP-PAD TO DIP-14 SMT
Package:
Bulk
Datasheet:
PA0192 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:PA0192
Category:Prototyping, Fabrication Products
Subcategory:Adapter, Breakout Boards
Manufacturer:Chip Quik Inc.
Packaging:Bulk
Product Status:Active
Proto Board Type:SMD to DIP
Package Accepted:TSSOP
Number of Positions:14
Pitch:0.026" (0.65mm)
Board Thickness:0.062" (1.57mm) 1/16"
Material:FR4 Epoxy Glass
Size / Dimension:0.700" x 0.700" (17.78mm x 17.78mm)
In Stock: 0
Stock:
0 Can Ship Immediately
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