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See Product Specifications
| Part Number: | PA0066-S |
| Category: | Soldering, Desoldering, Rework Products |
| Subcategory: | Solder Stencils, Templates |
| Manufacturer: | Chip Quik Inc. |
| Packaging: | Bulk |
| Product Status: | Active |
| Type: | QFN/LFCSP |
| Number of Positions: | 28 |
| Pitch: | 0.031" (0.80mm) |
| Outer Dimension: | 1.300" L x 0.900" W (33.02mm x 22.86mm) |
| Inner Dimension: | 0.276" L x 0.276" W (7.00mm x 7.00mm) |
| Thermal Center Pad: | - |
| Material: | Stainless Steel |
