PA0026C

PA0026C

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See Product Specifications

PA0026C
Description:
UMAX-8/USOP-8/MSOP-8 TO DIP-8 SM
Package:
Bulk
Datasheet:
PA0026C Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:PA0026C
Category:Prototyping, Fabrication Products
Subcategory:Adapter, Breakout Boards
Manufacturer:Chip Quik Inc.
Packaging:Bulk
Product Status:Active
Proto Board Type:SMD to DIP
Package Accepted:MSOP, uMAX, uSOP
Number of Positions:8
Pitch:0.026" (0.65mm)
Board Thickness:0.063" (1.60mm)
Material:FR4 Epoxy Glass
Size / Dimension:0.400" L x 0.400" W (10.16mm x 10.16mm)
In Stock: 41
Stock:
41 Can Ship Immediately
  • Share:
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