48-6553-18

48-6553-18

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48-6553-18
Description:
CONN IC DIP SOCKET ZIF 48POS
Package:
Bulk
Datasheet:
48-6553-18 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:48-6553-18
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Aries Electronics
Packaging:Bulk
Product Status:Active
Type:DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):48 (2 x 24)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Nickel Boron
Contact Finish Thickness - Mating:50.0µin (1.27µm)
Contact Material - Mating:Beryllium Nickel
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Nickel Boron
Contact Finish Thickness - Post:50.0µin (1.27µm)
Contact Material - Post:Beryllium Nickel
Housing Material:Polyetheretherketone (PEEK), Glass Filled
Operating Temperature:-55°C ~ 250°C
In Stock: 0
Stock:
0 Can Ship Immediately
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