28-8459-610C

28-8459-610C

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28-8459-610C
Description:
CONN IC DIP SOCKET 28POS GOLD
Package:
Bulk
Datasheet:
28-8459-610C Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:28-8459-610C
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Aries Electronics
Packaging:Bulk
Product Status:Active
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):28 (2 x 14)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame, Elevated
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:-55°C ~ 105°C
In Stock: 0
Stock:
0 Can Ship Immediately
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For Use With
4824-3000-CP
4824-3000-CP
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117-83-316-41-005101
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210-99-306-41-001000
210-99-306-41-001000
Mill-Max Manufacturing Corp.
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126-91-318-41-002000
126-91-318-41-002000
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24-3508-31
24-3508-31
Aries Electronics
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44-6575-16
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SKT PGA SOLDRTL
523-93-177-15-061002
523-93-177-15-061002
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
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