28-8300-610C

28-8300-610C

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28-8300-610C
Description:
CONN IC DIP SOCKET 28POS GOLD
Package:
Bulk
Datasheet:
28-8300-610C Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:28-8300-610C
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Aries Electronics
Packaging:Bulk
Product Status:Active
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):28 (2 x 14)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame, Elevated
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:-55°C ~ 105°C
In Stock: 0
Stock:
0 Can Ship Immediately
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