28-526-11

28-526-11

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28-526-11
Description:
CONN IC DIP SOCKET ZIF 28POS GLD
Package:
Bulk
Datasheet:
28-526-11 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:28-526-11
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Aries Electronics
Packaging:Bulk
Product Status:Active
Type:DIP, ZIF (ZIP)
Number of Positions or Pins (Grid):28 (2 x 14)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:-55°C ~ 125°C
In Stock: 12
Stock:
12 Can Ship Immediately
  • Share:
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