28-3553-16

28-3553-16

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28-3553-16
Description:
CONN IC DIP SOCKET ZIF 28POS
Package:
Bulk
Datasheet:
28-3553-16 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:28-3553-16
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Aries Electronics
Packaging:Bulk
Product Status:Active
Type:DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):28 (2 x 14)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Nickel Boron
Contact Finish Thickness - Mating:50.0µin (1.27µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Nickel Boron
Contact Finish Thickness - Post:50.0µin (1.27µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature:-
In Stock: 0
Stock:
0 Can Ship Immediately
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For Use With
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