257-PLS20018-12

257-PLS20018-12

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257-PLS20018-12
Description:
CONN SOCKET PGA ZIF GOLD
Package:
Bulk
Datasheet:
257-PLS20018-12 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:257-PLS20018-12
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Aries Electronics
Packaging:Bulk
Product Status:Active
Type:PGA, ZIF (ZIP)
Number of Positions or Pins (Grid):-
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polyphenylene Sulfide (PPS)
Operating Temperature:-65°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
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