24-4518-11H

24-4518-11H

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24-4518-11H
Description:
CONN IC DIP SOCKET 24POS GOLD
Package:
Bulk
Datasheet:
24-4518-11H Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:24-4518-11H
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Aries Electronics
Packaging:Bulk
Product Status:Active
Type:DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid):24 (2 x 12)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:-
In Stock: 0
Stock:
0 Can Ship Immediately
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