20-8190-310C

20-8190-310C

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20-8190-310C
Description:
CONN IC DIP SOCKET 20POS GOLD
Package:
Bulk
Datasheet:
20-8190-310C Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:20-8190-310C
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Aries Electronics
Packaging:Bulk
Product Status:Active
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):20 (2 x 10)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame, Elevated
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:-55°C ~ 105°C
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
540-44-020-17-400004
540-44-020-17-400004
Mill-Max Manufacturing Corp.
CONN SKT PLCC
16-C195-11
16-C195-11
Aries Electronics
CONN IC DIP SOCKET 16POS GOLD
116-87-642-41-013101
116-87-642-41-013101
Preci-Dip
CONN IC DIP SOCKET 42POS GOLD
317-47-103-41-005000
317-47-103-41-005000
Mill-Max Manufacturing Corp.
STANDRD SOLDRTL SNG SKT
110-41-642-41-105000
110-41-642-41-105000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
510-93-065-10-051003
510-93-065-10-051003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
550-10-388M26-001152
550-10-388M26-001152
Preci-Dip
BGA SOLDER TAIL
4-1571551-7
4-1571551-7
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 22POS GOLD
1109800-28
1109800-28
Aries Electronics
CONN IC DIP SOCKET 28POS GOLD
515-13-049-07-000002
515-13-049-07-000002
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
515-93-225-18-091001
515-93-225-18-091001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
522-13-025-05-000001
522-13-025-05-000001
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
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