SIP1X27-001BLF

SIP1X27-001BLF

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SIP1X27-001BLF
Description:
CONN SOCKET SIP 27POS GOLD
Package:
Bulk
Datasheet:
SIP1X27-001BLF Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:SIP1X27-001BLF
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Amphenol ICC (FCI)
Packaging:Bulk
Product Status:Obsolete
Type:SIP
Number of Positions or Pins (Grid):27 (1 x 27)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature:-
In Stock: 0
Stock:
0 Can Ship Immediately
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