SIP050-1X22-157BLF

SIP050-1X22-157BLF

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SIP050-1X22-157BLF
Description:
CONN SOCKET SIP 22POS TIN
Package:
Bulk
Datasheet:
SIP050-1X22-157BLF Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:SIP050-1X22-157BLF
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Amphenol ICC (FCI)
Packaging:Bulk
Product Status:Obsolete
Type:SIP
Number of Positions or Pins (Grid):22 (1 x 22)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:200.0µin (5.08µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:-
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
123-13-308-41-001000
123-13-308-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 8POS GOLD
20-3518-101
20-3518-101
Aries Electronics
CONN IC DIP SOCKET 20POS GOLD
317-91-116-41-005000
317-91-116-41-005000
Mill-Max Manufacturing Corp.
CONN SKT SNG
116-41-952-41-006000
116-41-952-41-006000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
614-93-652-31-018000
614-93-652-31-018000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 52POS GOLD
510-93-064-08-000003
510-93-064-08-000003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
14-81100-10
14-81100-10
Aries Electronics
CONN IC DIP SOCKET 14POS TIN
523-13-176-15-061003
523-13-176-15-061003
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
523-13-177-15-061001
523-13-177-15-061001
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
551-10-145-15-002003
551-10-145-15-002003
Mill-Max Manufacturing Corp.
CONN HDR SOLDRTL
551-90-088-13-062003
551-90-088-13-062003
Mill-Max Manufacturing Corp.
CONN HDR SOLDRTL
614-93-100-13-062007
614-93-100-13-062007
Mill-Max Manufacturing Corp.
SKT CARRIER PGA
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