SIP050-1X20-157BLF

SIP050-1X20-157BLF

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SIP050-1X20-157BLF
Description:
CONN SOCKET SIP 20POS TIN
Package:
Bulk
Datasheet:
SIP050-1X20-157BLF Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:SIP050-1X20-157BLF
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Amphenol ICC (FCI)
Packaging:Bulk
Product Status:Obsolete
Type:SIP
Number of Positions or Pins (Grid):20 (1 x 20)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:200.0µin (5.08µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:-
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
115-47-314-41-001000
115-47-314-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 14POS GOLD
01-0513-10
01-0513-10
Aries Electronics
CONN SOCKET SIP 1POS GOLD
08-1518-10
08-1518-10
Aries Electronics
CONN IC DIP SOCKET 8POS GOLD
10-6513-10T
10-6513-10T
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
612-91-316-41-003000
612-91-316-41-003000
Mill-Max Manufacturing Corp.
SKT CARRIER SOLDRTL
34-3513-11H
34-3513-11H
Aries Electronics
CONN IC DIP SOCKET 34POS GOLD
28-6556-41
28-6556-41
Aries Electronics
CONN IC DIP SOCKET 28POS GOLD
D2806-42
D2806-42
Harwin Inc.
CONN IC DIP SOCKET 6POS GOLD
511-13-224-18-095001
511-13-224-18-095001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
515-13-032-09-041001
515-13-032-09-041001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
515-13-072-11-061003
515-13-072-11-061003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
515-91-179-15-041002
515-91-179-15-041002
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
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