SIP050-1X19-160BLF

SIP050-1X19-160BLF

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SIP050-1X19-160BLF
Description:
CONN SOCKET SIP 19POS GOLD
Package:
Bulk
Datasheet:
SIP050-1X19-160BLF Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:SIP050-1X19-160BLF
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Amphenol ICC (FCI)
Packaging:Bulk
Product Status:Obsolete
Type:SIP
Number of Positions or Pins (Grid):19 (1 x 19)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:-
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
ICS-324-T
ICS-324-T
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Mill-Max Manufacturing Corp.
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Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
523-93-155-16-003003
523-93-155-16-003003
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
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