SIP050-1X02-157BLF

SIP050-1X02-157BLF

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SIP050-1X02-157BLF
Description:
CONN SOCKET SIP 2POS TIN
Package:
Bulk
Datasheet:
SIP050-1X02-157BLF Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:SIP050-1X02-157BLF
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Amphenol ICC (FCI)
Packaging:Bulk
Product Status:Obsolete
Type:SIP
Number of Positions or Pins (Grid):2 (1 x 2)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:200.0µin (5.08µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:-
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
116-83-320-41-004101
116-83-320-41-004101
Preci-Dip
CONN IC DIP SOCKET 20POS GOLD
10-0501-30
10-0501-30
Aries Electronics
CONN SOCKET SIP 10POS TIN
38-6501-30
38-6501-30
Aries Electronics
CONN IC DIP SOCKET 38POS TIN
126-91-310-41-002000
126-91-310-41-002000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
18-8750-310C
18-8750-310C
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
116-93-652-41-007000
116-93-652-41-007000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 52POS GOLD
510-91-028-06-005003
510-91-028-06-005003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
122-13-652-41-001000
122-13-652-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 52POS GOLD
126-41-964-41-001000
126-41-964-41-001000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
48-6822-90C
48-6822-90C
Aries Electronics
CONN IC DIP SOCKET 48POS GOLD
511-13-168-17-105001
511-13-168-17-105001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
523-93-153-15-061001
523-93-153-15-061001
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
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