DIP632-001BLF

DIP632-001BLF

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DIP632-001BLF
Description:
CONN IC DIP SOCKET 32POS GOLD
Package:
Bag
Datasheet:
DIP632-001BLF Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:DIP632-001BLF
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Amphenol ICC (FCI)
Packaging:Bag
Product Status:Obsolete
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):32 (2 x 16)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:-
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
116-83-314-41-004101
116-83-314-41-004101
Preci-Dip
CONN IC DIP SOCKET 14POS GOLD
346-43-121-41-013000
346-43-121-41-013000
Mill-Max Manufacturing Corp.
CONN SOCKET SIP 21POS GOLD
10-2822-90T
10-2822-90T
Aries Electronics
CONN IC DIP SOCKET 10POS TIN
510-13-052-09-045003
510-13-052-09-045003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
232-1291-00-0602J
232-1291-00-0602J
3M
CONN IC DIP SOCKET ZIF 32POS GLD
510-13-136-14-051001
510-13-136-14-051001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
808-AG10D
808-AG10D
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 8POS GOLD
511-91-156-15-061001
511-91-156-15-061001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
511-93-256-19-081002
511-93-256-19-081002
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
515-93-085-11-041003
515-93-085-11-041003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
522-13-223-18-098001
522-13-223-18-098001
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
551-90-068-10-041004
551-90-068-10-041004
Mill-Max Manufacturing Corp.
CONN HDR SOLDRTL
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