DIP628-001BLF

DIP628-001BLF

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DIP628-001BLF
Description:
CONN IC DIP SOCKET 28POS GOLD
Package:
Bag
Datasheet:
DIP628-001BLF Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:DIP628-001BLF
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Amphenol ICC (FCI)
Packaging:Bag
Product Status:Obsolete
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):28 (2 x 14)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:-
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
510-83-036-06-000101
510-83-036-06-000101
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116-83-318-41-007101
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116-93-628-41-003000
116-93-628-41-003000
Mill-Max Manufacturing Corp.
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18-822-90
18-822-90
Aries Electronics
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515-91-175-16-005002
515-91-175-16-005002
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522-13-209-17-081003
522-13-209-17-081003
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
614-13-088-13-062001
614-13-088-13-062001
Mill-Max Manufacturing Corp.
SKT CARRIER PGA
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