DIP324-014BLF

DIP324-014BLF

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DIP324-014BLF
Description:
CONN IC DIP SOCKET 24POS TIN
Package:
Bag
Datasheet:
DIP324-014BLF Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:DIP324-014BLF
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Amphenol ICC (FCI)
Packaging:Bag
Product Status:Obsolete
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):24 (2 x 12)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:100.0µin (2.54µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:-
In Stock: 0
Stock:
0 Can Ship Immediately
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For Use With
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