DIP316-011BLF

DIP316-011BLF

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DIP316-011BLF
Description:
CONN IC DIP SOCKET 16POS GOLD
Package:
Bag
Datasheet:
DIP316-011BLF Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:DIP316-011BLF
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Amphenol ICC (FCI)
Packaging:Bag
Product Status:Obsolete
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):16 (2 x 8)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:-
In Stock: 0
Stock:
0 Can Ship Immediately
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For Use With
110-47-308-41-105000
110-47-308-41-105000
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Aries Electronics
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612-13-316-41-001000
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Mill-Max Manufacturing Corp.
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28-81250-610C
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Aries Electronics
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TE Connectivity AMP Connectors
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514-AG7D
514-AG7D
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