DILB16P-223TLF

DILB16P-223TLF

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DILB16P-223TLF
Description:
CONN IC DIP SOCKET 16POS TIN
Package:
Tube
Datasheet:
DILB16P-223TLF Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:DILB16P-223TLF
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Amphenol ICC (FCI)
Packaging:Tube
Product Status:Active
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):16 (2 x 8)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:100.0µin (2.54µm)
Contact Material - Mating:Copper Alloy
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:100.0µin (2.54µm)
Contact Material - Post:Copper Alloy
Housing Material:Polyamide (PA), Nylon
Operating Temperature:-55°C ~ 105°C
In Stock: 6365
Stock:
6365 Can Ship Immediately
  • Share:
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