55510-822TRLF

55510-822TRLF

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55510-822TRLF
Description:
CONN RCPT 0.079 GOLD SMD
Package:
Tape & Reel (TR)
Datasheet:
55510-822TRLF Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:55510-822TRLF
Category:Connectors, Interconnects
Subcategory:Rectangular Connectors - Headers, Receptacles, Female Sockets
Manufacturer:Amphenol ICC (FCI)
Packaging:Tape & Reel (TR)
Product Status:Active
Connector Type:Receptacle
Contact Type:Female Socket
Style:Board to Board
Number of Positions:22
Number of Positions Loaded:All
Pitch - Mating:0.079" (2.00mm)
Number of Rows:2
Row Spacing - Mating:0.079" (2.00mm)
Mounting Type:Surface Mount
Termination:Solder
Fastening Type:Push-Pull
Contact Finish - Mating:Gold, GXT™
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Insulation Color:Black
Insulation Height:0.177" (4.50mm)
Contact Length - Post:-
Operating Temperature:-55°C ~ 125°C
Material Flammability Rating:UL94 V-0
Contact Finish - Post:Gold, GXT™
Mated Stacking Heights:-
Ingress Protection:-
Features:Pick and Place
Current Rating (Amps):2A
Voltage Rating:200V
In Stock: 0
Stock:
0 Can Ship Immediately
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For Use With
BF120-14-A-0-N-D
BF120-14-A-0-N-D
GCT
14W, 2MM SOCKET, DIL, SMT, VERT,
CLP-108-02-F-D-BE-PA
CLP-108-02-F-D-BE-PA
Samtec Inc.
CONN RCPT 16POS 0.05 GOLD SMD
833-83-062-30-001101
833-83-062-30-001101
Preci-Dip
CONN SOCKET 62POS 0.079 GOLD SMD
415-11-202-41-003000
415-11-202-41-003000
Mill-Max Manufacturing Corp.
CONN RCPT 2POS GOLD PCB
BCS-117-L-D-DE-026
BCS-117-L-D-DE-026
Samtec Inc.
CONN RCPT 34POS 0.1 GOLD PCB
BCS-150-L-S-DE-039
BCS-150-L-S-DE-039
Samtec Inc.
CONN RCPT 50POS 0.1 GOLD PCB
CLT-143-01-F-D
CLT-143-01-F-D
Samtec Inc.
CONN RCPT 86POS 0.079 GOLD PCB
ESQT-109-02-G-D-380
ESQT-109-02-G-D-380
Samtec Inc.
CONN SOCKET 18POS 0.079 GOLD PCB
ESQT-132-03-M-D-368-001
ESQT-132-03-M-D-368-001
Samtec Inc.
CONN SOCKET 64POS 0.079 GOLD PCB
SSM-131-LM-DV
SSM-131-LM-DV
Samtec Inc.
CONN RCPT 62POS 0.1 GOLD SMD
SQT-148-03-F-Q
SQT-148-03-F-Q
Samtec Inc.
CONN RCPT 192POS 0.079 GOLD PCB
SS-108-G-29
SS-108-G-29
Samtec Inc.
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