8114LB603 REV J

8114LB603 REV J

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8114LB603 REV J
Description:
CONN TRANSIST TO-3 4POS TIN
Package:
Bulk
Datasheet:
8114LB603 REV J Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:8114LB603 REV J
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Aavid, Thermal Division of Boyd Corporation
Packaging:Bulk
Product Status:Active
Type:Transistor, TO-3
Number of Positions or Pins (Grid):4 (Oval)
Pitch - Mating:-
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:-
Contact Material - Mating:Brass
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:-
Contact Finish - Post:Tin
Contact Finish Thickness - Post:-
Contact Material - Post:Brass
Housing Material:Phenolic
Operating Temperature:-
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
110-87-632-41-001101
110-87-632-41-001101
Preci-Dip
CONN IC DIP SOCKET 32POS GOLD
14-8470-10WR
14-8470-10WR
Aries Electronics
CONN IC DIP SOCKET 14POS TIN
510-87-236-17-061101
510-87-236-17-061101
Preci-Dip
CONN SOCKET PGA 236POS GOLD
317-47-106-41-005000
317-47-106-41-005000
Mill-Max Manufacturing Corp.
STANDRD SOLDRTL SNG SKT
210-91-424-41-001000
210-91-424-41-001000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
24-6823-90C
24-6823-90C
Aries Electronics
CONN IC DIP SOCKET 24POS GOLD
126-41-316-41-001000
126-41-316-41-001000
Mill-Max Manufacturing Corp.
CONN IC SKT DBL
31-7440-10
31-7440-10
Aries Electronics
CONN SOCKET SIP 31POS TIN
BU200Z-178-HT
BU200Z-178-HT
On Shore Technology Inc.
CONN IC DIP SOCKET 20POS GOLD
515-93-072-11-042001
515-93-072-11-042001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
522-93-056-09-041001
522-93-056-09-041001
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
522-93-273-21-125002
522-93-273-21-125002
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
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