5021NG

5021NG

Images are for reference only
See Product Specifications

5021NG
Description:
HEATSINK
Package:
Bulk
Datasheet:
5021NG Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:5021NG
Category:Boxes, Enclosures, Racks
Subcategory:Card Guide Accessories
Manufacturer:Aavid, Thermal Division of Boyd Corporation
Packaging:Bulk
Product Status:Active
Accessory Type:Ejector
For Use With/Related Products:-
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
422C-580SSG-CP
422C-580SSG-CP
Wakefield-Vette
WEDGELOCK 5.80" GOLD CHROMATE
1001-062 BK
1001-062 BK
Bivar Inc.
INSRT/EXTRCT PCB 1.94" .063" BLK
CP-46 GN
CP-46 GN
Bivar Inc.
EJECTOR PCB 1.5" NYL 0.062" GRN
CP-46 YW
CP-46 YW
Bivar Inc.
EJECTOR PCB 1.5" NYL 0.062" YLW
426C-330UMG
426C-330UMG
Wakefield-Vette
WEDGELOCK 3.30" GOLD CHROMATE
422C-530SSB-P
422C-530SSB-P
Wakefield-Vette
WEDGELOCK 5.30" ANODIZE
422C-530MMB-CP
422C-530MMB-CP
Wakefield-Vette
WEDGELOCK 5.30" ANODIZE
422C-380MMH-K
422C-380MMH-K
Wakefield-Vette
WEDGELOCK 3.80" HARD ANODIZE
426C-280MME
426C-280MME
Wakefield-Vette
WEDGELOCK 2.80" ELECTROLESS NI
422C-530SSH-CP
422C-530SSH-CP
Wakefield-Vette
WEDGELOCK 5.30" HARD ANODIZE
426C-580UME-CKP
426C-580UME-CKP
Wakefield-Vette
WEDGELOCK 5.80" ELECTROLESS NI
CP-59 RD
CP-59 RD
Bivar Inc.
CARD EJECTOR PCB
You May Also Be Interested In
5901G
5901G
Aavid, Thermal Division of Boyd Corporation
BOARD LEVEL HEAT SINK
HP-CWS-R03-100-N
HP-CWS-R03-100-N
Aavid, Thermal Division of Boyd Corporation
COPPER-WATER HEAT PIPE, ROUND, D
577202B00000G
577202B00000G
Aavid, Thermal Division of Boyd Corporation
HEAT SINK TO-220 .500" COMPACT
7106DG
7106DG
Aavid, Thermal Division of Boyd Corporation
BOARD LEVEL HEATSINK .375" D2PAK
531002B00000G
531002B00000G
Aavid, Thermal Division of Boyd Corporation
HEATSINK TO-220 BLACK 1"
575200B00000G
575200B00000G
Aavid, Thermal Division of Boyd Corporation
HEATSINK TO-92 .72" BLK
532602B02500G
532602B02500G
Aavid, Thermal Division of Boyd Corporation
HEATSINK TO-220 SOLDERPIN 38.1MM
2263R
2263R
Aavid, Thermal Division of Boyd Corporation
BOARD LEVEL HEAT SINK
53-02-103G
53-02-103G
Aavid, Thermal Division of Boyd Corporation
THERM PAD 23.8X19.05MM GRY/GRN
53-03-16
53-03-16
Aavid, Thermal Division of Boyd Corporation
THERM PAD 43.18X30.15MM GRY/GRN
S500-70/2-007
S500-70/2-007
Aavid, Thermal Division of Boyd Corporation
SILICONE -007 O-RING
E300-70/2-006
E300-70/2-006
Aavid, Thermal Division of Boyd Corporation
EPDM -006 O-RING