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See Product Specifications
| Part Number: | 260-5204-01 |
| Category: | Connectors, Interconnects |
| Subcategory: | Sockets for ICs, Transistors |
| Manufacturer: | 3M |
| Packaging: | Bulk |
| Product Status: | Active |
| Type: | QFN |
| Number of Positions or Pins (Grid): | 60 (4 x 15) |
| Pitch - Mating: | 0.020" (0.50mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.020" (0.50mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyethersulfone (PES) |
| Operating Temperature: | - |
