256-6313-9UA-1902

256-6313-9UA-1902

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256-6313-9UA-1902
Mfr.:
Description:
PGA 13 X 13
Package:
Bulk
Datasheet:
256-6313-9UA-1902 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:256-6313-9UA-1902
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:3M
Packaging:Bulk
Product Status:Obsolete
Type:PGA, ZIF (ZIP)
Number of Positions or Pins (Grid):56 (13 x 13)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:30.0µin (0.76µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polyethersulfone (PES)
Operating Temperature:-55°C ~ 150°C
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
299-43-632-10-002000
299-43-632-10-002000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 32POS GOLD
20-0518-10
20-0518-10
Aries Electronics
CONN SOCKET SIP 20POS GOLD
22-4518-00
22-4518-00
Aries Electronics
CONN IC DIP SOCKET 22POS GOLD
14-820-90
14-820-90
Aries Electronics
CONN IC DIP SOCKET 14POS GOLD
20-7512-10
20-7512-10
Aries Electronics
CONN SOCKET SIP 20POS TIN
126-93-328-41-002000
126-93-328-41-002000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 28POS GOLD
18-820-90
18-820-90
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
124-93-950-41-002000
124-93-950-41-002000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 50POS GOLD
24-3508-212
24-3508-212
Aries Electronics
CONN IC DIP SOCKET 24POS GOLD
511-13-096-11-041001
511-13-096-11-041001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
511-13-133-14-071003
511-13-133-14-071003
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
551-90-224-18-095005
551-90-224-18-095005
Mill-Max Manufacturing Corp.
CONN HDR SOLDRTL
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