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See Product Specifications
| Part Number: | 228-1371-00-0602J |
| Category: | Connectors, Interconnects |
| Subcategory: | Sockets for ICs, Transistors |
| Manufacturer: | 3M |
| Packaging: | Tray |
| Product Status: | Active |
| Type: | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 28 (2 x 14) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Connector |
| Features: | Closed Frame |
| Termination: | Press-Fit |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polysulfone (PSU), Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
