228-1290-00-0602J

228-1290-00-0602J

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228-1290-00-0602J
Mfr.:
Description:
CONN IC DIP SOCKET ZIF 28POS GLD
Package:
Bulk
Datasheet:
228-1290-00-0602J Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:228-1290-00-0602J
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:3M
Packaging:Bulk
Product Status:Active
Type:DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):28 (2 x 14)
Pitch - Mating:0.070" (1.78mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Connector
Features:Closed Frame
Termination:Press-Fit
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:30.0µin (0.76µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polysulfone (PSU), Glass Filled
Operating Temperature:-55°C ~ 125°C
In Stock: 61
Stock:
61 Can Ship Immediately
  • Share:
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