2108-6313-9UA-1902

2108-6313-9UA-1902

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2108-6313-9UA-1902
Mfr.:
Description:
GRID ZIP 13 X 13
Package:
Bulk
Datasheet:
2108-6313-9UA-1902 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:2108-6313-9UA-1902
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:3M
Packaging:Bulk
Product Status:Obsolete
Type:PGA, ZIF (ZIP)
Number of Positions or Pins (Grid):108 (13 x 13)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:30.0µin (0.76µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polyethersulfone (PES)
Operating Temperature:-55°C ~ 150°C
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
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