Images are for reference only
See Product Specifications
| Part Number: | 200-6325-9UN-1900 |
| Category: | Connectors, Interconnects |
| Subcategory: | Sockets for ICs, Transistors |
| Manufacturer: | 3M |
| Packaging: | Bulk |
| Product Status: | Obsolete |
| Type: | PGA, ZIF (ZIP) |
| Number of Positions or Pins (Grid): | 625 (25 x 25) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | - |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyethersulfone (PES) |
| Operating Temperature: | -55°C ~ 150°C |
