100-032-050

100-032-050

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100-032-050
Mfr.:
Description:
CONN IC DIP SOCKET 32POS GOLD
Package:
Bulk
Datasheet:
100-032-050 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:100-032-050
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:3M
Packaging:Bulk
Product Status:Obsolete
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):32 (2 x 16)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:8.00µin (0.203µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:Flash
Contact Material - Post:Brass
Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature:-65°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
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