100-028-051

100-028-051

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100-028-051
Mfr.:
Description:
CONN IC DIP SOCKET 28POS GOLD
Package:
Bulk
Datasheet:
100-028-051 Datasheet (PDF)
ECAD Model:
-
Product Attributes
Part Number:100-028-051
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:3M
Packaging:Bulk
Product Status:Obsolete
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):28 (2 x 14)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:8.00µin (0.203µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame, Seal Tape
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:Flash
Contact Material - Post:Brass
Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature:-65°C ~ 125°C
In Stock: 0
Stock:
0 Can Ship Immediately
  • Share:
For Use With
116-83-428-41-001101
116-83-428-41-001101
Preci-Dip
CONN IC DIP SOCKET 28POS GOLD
16-3513-00
16-3513-00
Aries Electronics
CONN IC DIP SOCKET 16POS GOLD
510-83-133-13-002101
510-83-133-13-002101
Preci-Dip
CONN SOCKET PGA 133POS GOLD
612-93-310-41-003000
612-93-310-41-003000
Mill-Max Manufacturing Corp.
SKT CARRIER SOLDRTL
30-9513-10H
30-9513-10H
Aries Electronics
CONN IC DIP SOCKET 30POS GOLD
614-41-322-31-002000
614-41-322-31-002000
Mill-Max Manufacturing Corp.
SKT CARRIER PGA
28-6551-18
28-6551-18
Aries Electronics
CONN IC DIP SOCKET ZIF 28POS
PLCC-028-T-N
PLCC-028-T-N
Samtec Inc.
CONN SOCKET PLCC 28POS TIN
515-91-045-08-005001
515-91-045-08-005001
Mill-Max Manufacturing Corp.
SKT PGA SOLDRTL
522-93-084-11-045002
522-93-084-11-045002
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
523-93-089-12-051001
523-93-089-12-051001
Mill-Max Manufacturing Corp.
SKT PGA WRAPOST
614-13-156-15-061012
614-13-156-15-061012
Mill-Max Manufacturing Corp.
SKT CARRIER PGA
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